HD74LS138P vs MM74HCT138MX feature comparison

HD74LS138P Hitachi Ltd

Buy Now Datasheet

MM74HCT138MX Fairchild Semiconductor Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description DP-16 0.150 INCH, MS-012, SOIC-16
Pin Count 16 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HCT
Input Conditioning STANDARD
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.2 mm 9.9 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.008 A 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 10 mA
Prop. Delay@Nom-Sup 41 ns 50 ns
Propagation Delay (tpd) 41 ns 60 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 2
Pbfree Code Yes
Manufacturer Package Code 16LD,SOIC,JEDEC MS-012,.150" ,NARROW BODY
Additional Feature 3 ENABLE INPUTS
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74LS138P with alternatives

Compare MM74HCT138MX with alternatives