HD74LS138P
vs
MM74HCT138MX
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
DIP
SOIC
Package Description
DP-16
0.150 INCH, MS-012, SOIC-16
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HCT
Input Conditioning
STANDARD
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
Length
19.2 mm
9.9 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.008 A
0.004 A
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
10 mA
Prop. Delay@Nom-Sup
41 ns
50 ns
Propagation Delay (tpd)
41 ns
60 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL EXTENDED
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
1
2
Pbfree Code
Yes
Manufacturer Package Code
16LD,SOIC,JEDEC MS-012,.150" ,NARROW BODY
Additional Feature
3 ENABLE INPUTS
JESD-609 Code
e3
Load Capacitance (CL)
50 pF
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare HD74LS138P with alternatives
Compare MM74HCT138MX with alternatives