HD74LS76ARP vs M38510/30106BEB feature comparison

HD74LS76ARP Hitachi Ltd

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M38510/30106BEB Philips Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HITACHI LTD SIGNETICS CORP
Part Package Code SOIC
Package Description SOP, SOP16,.25 DIP,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDSO-G16 R-GDIP-T16
Length 9.9 mm
Load Capacitance (CL) 15 pF
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Max I(ol) 0.008 A
Number of Bits 2 1
Number of Functions 2 6
Number of Terminals 16 16
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -20 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Power Supply Current-Max (ICC) 6 mA
Prop. Delay@Nom-Sup 20 ns
Propagation Delay (tpd) 20 ns 52 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 3.95 mm
fmax-Min 30 MHz 25 MHz
Base Number Matches 2 3
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

Compare HD74LS76ARP with alternatives

Compare M38510/30106BEB with alternatives