HD74LV1GW14ACME
vs
74AUP1G3208GW
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NEXPERIA
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP, TSSOP6,.08
|
TSSOP,
|
| Pin Count |
6
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LV/LV-A/LVX/H
|
AUP/ULP/V
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e6
|
e3
|
| Length |
2 mm
|
2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
INVERTER
|
OR-AND GATE
|
| Max I(ol) |
0.006 A
|
|
| Number of Functions |
2
|
1
|
| Number of Inputs |
1
|
3
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
18.5 ns
|
|
| Propagation Delay (tpd) |
46 ns
|
20.1 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN BISMUTH
|
TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HD74LV1GW14ACME with alternatives
Compare 74AUP1G3208GW with alternatives