HD74LV245ARP
vs
74LV245DB,112
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SSOP2
|
| Package Description |
SOP, SOP20,.4
|
5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LV/LV-A/LVX/H
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
12.8 mm
|
7.2 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.008 A
|
0.008 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SSOP
|
| Package Equivalence Code |
SOP20,.4
|
SSOP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
13.5 ns
|
20 ns
|
| Propagation Delay (tpd) |
18 ns
|
34 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
5.3 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
SOT339-1
|
| Factory Lead Time |
|
4 Weeks
|
| Additional Feature |
|
WITH DIRECTION CONTROL
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HD74LV245ARP with alternatives
Compare 74LV245DB,112 with alternatives