HD74LV32AFP-E vs MC74AC32MR1 feature comparison

HD74LV32AFP-E Renesas Electronics Corporation

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MC74AC32MR1 onsemi

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP ONSEMI
Part Package Code SOIC SOIC
Package Description SOP, EIAJ, SO-14
Pin Count 14 14
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e6 e0
Length 10.06 mm 10.2 mm
Logic IC Type OR GATE OR GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 19 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.05 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.275 mm
Base Number Matches 1 2
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.012 A
Package Equivalence Code SOP14,.3
Packing Method TR
Prop. Delay@Nom-Sup 10 ns
Schmitt Trigger NO

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