HD74LV32AFP-E vs N74AC32PW-T feature comparison

HD74LV32AFP-E Renesas Electronics Corporation

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N74AC32PW-T NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP, TSSOP,
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e6
Length 10.06 mm 5 mm
Logic IC Type OR GATE OR GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 19 ns 6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.5 mm 4.4 mm
Base Number Matches 1 1
Load Capacitance (CL) 50 pF

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