HD74LVC74T
vs
MC74LCX74DTR2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP, TSSOP14,.25
|
TSSOP, TSSOP14,.25
|
Pin Count |
14
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
LVC/LCX/Z
|
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
Length |
5 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
150000000 Hz
|
150000000 Hz
|
Max I(ol) |
0.024 A
|
0.024 A
|
Number of Bits |
1
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP14,.25
|
TSSOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Prop. Delay@Nom-Sup |
8 ns
|
7 ns
|
Propagation Delay (tpd) |
9 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
4.4 mm
|
|
fmax-Min |
150 MHz
|
|
Base Number Matches |
2
|
5
|
JESD-609 Code |
|
e0
|
Packing Method |
|
TAPE AND REEL
|
Power Supplies |
|
3.3 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare HD74LVC74T with alternatives