HD9P6409-9Z96
vs
3D7523-5
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
DATA DELAY DEVICES INC
|
| Part Package Code |
SOICW
|
DIP
|
| Package Description |
SOP, SOP20,.4
|
DIP,
|
| Pin Count |
20
|
14
|
| Manufacturer Package Code |
M20.3
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks, 1 Day
|
|
| Date Of Intro |
2017-10-20
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Data Rate |
1000 Mbps
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDIP-T14
|
| JESD-609 Code |
e3
|
|
| Length |
12.8 mm
|
19.305 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Seated Height-Max |
2.65 mm
|
4.57 mm
|
| Supply Current-Max |
18 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
MANCHESTER ENCODER/DECODER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare HD9P6409-9Z96 with alternatives
Compare 3D7523-5 with alternatives