HEC4069UBD vs 74HCT04PW-Q100 feature comparison

HEC4069UBD NXP Semiconductors

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74HCT04PW-Q100 Nexperia

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Package Description DIP, TSSOP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 HCT
JESD-30 Code R-CDIP-T14 R-PDSO-G14
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 90 ns 29 ns
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 15 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 2 2
Rohs Code Yes
Date Of Intro 2017-02-01
JESD-609 Code e4
Length 5 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Terminal Finish NICKEL PALLADIUM GOLD SILVER
Time@Peak Reflow Temperature-Max (s) 30

Compare HEC4069UBD with alternatives

Compare 74HCT04PW-Q100 with alternatives