HEC4069UBD vs MC14069UBCPG feature comparison

HEC4069UBD NXP Semiconductors

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MC14069UBCPG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Package Description DIP, LEAD FREE, PLASTIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 90 ns 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.69 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
ECCN Code EAR99
Samacsys Manufacturer onsemi
JESD-609 Code e3
Length 18.86 mm
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 125 ns
Schmitt Trigger NO
Terminal Finish Tin (Sn)

Compare HEC4069UBD with alternatives

Compare MC14069UBCPG with alternatives