HEC4093BDB
vs
5962R9664101VCC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTERSIL CORP
|
| Package Description |
DIP,
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-GDIP-T14
|
R-CDIP-T14
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
185 ns
|
513 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Additional Feature |
|
RADIATION HARDENED
|
| JESD-609 Code |
|
e4
|
| Length |
|
19.43 mm
|
| Max I(ol) |
|
0.00064 A
|
| Package Equivalence Code |
|
DIP14,.3
|
| Prop. Delay@Nom-Sup |
|
513 ns
|
| Schmitt Trigger |
|
YES
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Terminal Finish |
|
GOLD
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare HEC4093BDB with alternatives
Compare 5962R9664101VCC with alternatives