HEF4001BP
vs
5962R9582605V9A
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
MO-001
|
|
| Package Description |
300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14
|
DIE,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDIP-T14
|
R-XUUC-N14
|
| JESD-609 Code |
e4
|
|
| Length |
19.025 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NOR GATE
|
NOR GATE
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP14,.3
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Prop. Delay@Nom-Sup |
120 ns
|
|
| Propagation Delay (tpd) |
120 ns
|
338 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
4.2 mm
|
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
7.62 mm
|
|
| Base Number Matches |
4
|
1
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare HEF4001BP with alternatives
Compare 5962R9582605V9A with alternatives