HEF4011UBP,652 vs TC4011UBP feature comparison

HEF4011UBP,652 NXP Semiconductors

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TC4011UBP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4 e0
Length 19.025 mm 19.25 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.00035999999999999997 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 120 ns
Propagation Delay (tpd) 120 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.2 mm 4.45 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No

Compare HEF4011UBP,652 with alternatives

Compare TC4011UBP with alternatives