HEF4013BP vs 933373600005 feature comparison

HEF4013BP Philips Semiconductors

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933373600005 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP-14 DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 X-XUUC-N
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 7000000 Hz
Max I(ol) 0.00035999999999999997 A
Number of Functions 2 2
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Prop. Delay@Nom-Sup 220 ns
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 1
Part Package Code WAFER
Family 4000/14000/40000
Number of Bits 1
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 220 ns
fmax-Min 20 MHz

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