HEF4013BP
vs
935245290112
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP-14
|
SSOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
7000000 Hz
|
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
220 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Family |
|
4000/14000/40000
|
| Length |
|
6.2 mm
|
| Number of Bits |
|
1
|
| Output Polarity |
|
COMPLEMENTARY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
220 ns
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
5.3 mm
|
| fmax-Min |
|
20 MHz
|
|
|
|
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