HEF4013BP vs CD4013BMJ feature comparison

HEF4013BP Philips Semiconductors

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CD4013BMJ Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description DIP-14 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 7000000 Hz
Max I(ol) 0.00035999999999999997 A
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 220 ns
Qualification Status Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 4
Part Package Code DIP
Pin Count 14
Additional Feature LG-MAX
Family 4000/14000/40000
Length 19.939 mm
Number of Bits 1
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 350 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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