HEF4013BP
vs
GD4013B
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
GOLDSTAR ELECTRON CO LTD
|
Part Package Code |
MO-001
|
|
Package Description |
0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
|
DIP,
|
Pin Count |
14
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
NXP
|
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
JESD-609 Code |
e4
|
|
Length |
19.025 mm
|
19.31 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
7000000 Hz
|
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Packing Method |
BULK
|
|
Prop. Delay@Nom-Sup |
220 ns
|
|
Propagation Delay (tpd) |
220 ns
|
200 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.2 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
7.62 mm
|
7.62 mm
|
fmax-Min |
20 MHz
|
5 MHz
|
Base Number Matches |
2
|
1
|
|
|
|
Compare HEF4013BP with alternatives
Compare GD4013B with alternatives