HEF4013BPB vs CD4013BFMSH feature comparison

HEF4013BPB NXP Semiconductors

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CD4013BFMSH Harris Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 220 ns 405 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
fmax-Min 7 MHz 2.59 MHz
Base Number Matches 1 2
Rohs Code No
Additional Feature RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT
JESD-609 Code e0
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 405 ns
Screening Level 38535V;38534K;883S
Terminal Finish TIN LEAD
Total Dose 1M Rad(Si) V

Compare HEF4013BPB with alternatives

Compare CD4013BFMSH with alternatives