HEF4013BTS vs HEF4013BDF feature comparison

HEF4013BTS NXP Semiconductors

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HEF4013BDF NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SSOP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 220 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 7.62 mm
fmax-Min 20 MHz 7 MHz
Base Number Matches 1 1
Load Capacitance (CL) 50 pF
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Technology CMOS
Temperature Grade INDUSTRIAL

Compare HEF4013BTS with alternatives

Compare HEF4013BDF with alternatives