HEF4013BTSDB vs CD4013BHMS feature comparison

HEF4013BTSDB NXP Semiconductors

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CD4013BHMS Harris Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code SOIC
Package Description SSOP, DIE,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 X-XUUC-N14
Length 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SSOP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE, SHRINK PITCH UNCASED CHIP
Propagation Delay (tpd) 220 ns 405 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position DUAL UPPER
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm
fmax-Min 20 MHz 16 MHz
Base Number Matches 1 2
Load Capacitance (CL) 50 pF
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Technology CMOS
Temperature Grade MILITARY

Compare HEF4013BTSDB with alternatives

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