HEF4013BTSDB vs HCC4013BF feature comparison

HEF4013BTSDB NXP Semiconductors

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HCC4013BF SGS-Ates Componenti Electronici SPA

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SGS-ATES COMPONENTI ELECTRONICI S P A
Part Package Code SOIC
Package Description SSOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-XDIP-T14
Length 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm
fmax-Min 20 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 400 ns
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)

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