HEF4013BTSDB-T vs CD4013BFMSH feature comparison

HEF4013BTSDB-T NXP Semiconductors

Buy Now Datasheet

CD4013BFMSH Intersil Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code SOIC
Package Description SSOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-XDIP-T14
Length 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm
fmax-Min 20 MHz
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.00035999999999999997 A
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 405 ns
Screening Level 38535V;38534K;883S
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Total Dose 1M Rad(Si) V

Compare HEF4013BTSDB-T with alternatives