HEF4013BTSDB-T
vs
HEF4013BPN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SSOP,
|
DIP, DIP14,.3
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T14
|
| Length |
6.2 mm
|
19.025 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
| Propagation Delay (tpd) |
220 ns
|
220 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
4.2 mm
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
5.3 mm
|
7.62 mm
|
| fmax-Min |
20 MHz
|
7 MHz
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
50 pF
|
| Max Frequency@Nom-Sup |
|
7000000 Hz
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
DIP14,.3
|
| Packing Method |
|
BULK
|
| Prop. Delay@Nom-Sup |
|
220 ns
|
| Supply Voltage-Max (Vsup) |
|
15 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare HEF4013BTSDB-T with alternatives
Compare HEF4013BPN with alternatives