HEF4013BTT,118 vs MC14013BCLD feature comparison

HEF4013BTT,118 NXP Semiconductors

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MC14013BCLD Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 DIP, DIP14,.3
Pin Count 14
Manufacturer Package Code SOT402-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-XDIP-T14
JESD-609 Code e4 e0
Length 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 7000000 Hz
Moisture Sensitivity Level 1
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code TSSOP DIP
Package Equivalence Code TSSOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 220 ns 450 ns
Propagation Delay (tpd) 220 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm
fmax-Min 20 MHz
Base Number Matches 2 3
Power Supplies 5/15 V

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