HEF4013BU
vs
CD4013BCM
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
,
|
SOP, SOP14,.25
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
X-XUUC-N
|
R-PDSO-G14
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SOP
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Propagation Delay (tpd) |
220 ns
|
350 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
fmax-Min |
20 MHz
|
2.5 MHz
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Length |
|
8.65 mm
|
Load Capacitance (CL) |
|
50 pF
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
SOP14,.25
|
Prop. Delay@Nom-Sup |
|
350 ns
|
Seated Height-Max |
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
|
15 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
3.9 mm
|
|
|
|
Compare HEF4013BU with alternatives