HEF4013BU vs JM38510/05151BCA feature comparison

HEF4013BU NXP Semiconductors

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JM38510/05151BCA Defense Logistics Agency

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS DEFENSE LOGISTICS AGENCY
Part Package Code WAFER
Package Description , DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code X-XUUC-N R-CDIP-T14
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 220 ns 300 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 20 MHz 3.5 MHz
Base Number Matches 2 5
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Technology CMOS
Temperature Grade MILITARY

Compare HEF4013BU with alternatives

Compare JM38510/05151BCA with alternatives