HEF40175BT,652 vs CD40174BKMSR feature comparison

HEF40175BT,652 NXP Semiconductors

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CD40174BKMSR Harris Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code SOP
Package Description PLASTIC, SO-16 DFP, FL16,.3
Pin Count 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-CDFP-F16
JESD-609 Code e4 e0
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 5000000 Hz 3500000 Hz
Moisture Sensitivity Level 1
Number of Bits 4 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DFP
Package Equivalence Code SOP16,.25 FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE FLATPACK
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 160 ns 405 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm
fmax-Min 5 MHz 2.59 MHz
Base Number Matches 1 1
Additional Feature RADIATION HARDENED; INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT
Max I(ol) 0.00035999999999999997 A
Prop. Delay@Nom-Sup 405 ns
Screening Level 38535V;38534K;883S
Total Dose 100k Rad(Si) V

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