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HEF40175BT,652 vs MC14175BCP feature comparison

HEF40175BT,652 NXP Semiconductors

Buy Now Datasheet

MC14175BCP Motorola Semiconductor Products

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOP
Package Description PLASTIC, SO-16 DIP-16
Pin Count 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm 19.175 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 5000000 Hz 2000000 Hz
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 160 ns 400 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.44 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 7.62 mm
fmax-Min 5 MHz 2 MHz
Base Number Matches 1 4
Logic » FF/Latches
Logic » FF/Latches

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