HEF4017BP
vs
HEF4017BT
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Package Description |
DIP-16
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Count Direction |
UP
|
UP
|
JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Load/Preset Input |
NO
|
NO
|
Logic IC Type |
DECADE COUNTER
|
DECADE COUNTER
|
Max Frequency@Nom-Sup |
6000000 Hz
|
6000000 Hz
|
Max I(ol) |
0.00035999999999999997 A
|
0.00035999999999999997 A
|
Mode of Operation |
SYNCHRONOUS
|
SYNCHRONOUS
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|