HEF4024BT vs MC14024BDR2 feature comparison

HEF4024BT NXP Semiconductors

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MC14024BDR2 Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC SOIC
Package Description PLASTIC, SOT-108-1, SO-14 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e0
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Load/Preset Input NO NO
Logic IC Type BINARY COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 5000000 Hz 4000000 Hz
Max I(ol) 0.00035999999999999997 A 0.00088 A
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Moisture Sensitivity Level 1
Number of Bits 7 7
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 200 ns 2000 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 3.9 mm 3.9 mm
fmax-Min 35 MHz 1 MHz
Base Number Matches 6 1
Packing Method TR

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