HEF4024BTD-T
vs
TC4024BF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
End Of Life
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TOSHIBA CORP
|
| Package Description |
SOP, SOP14,.25
|
SOP, SOP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
UP
|
UP
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Load/Preset Input |
NO
|
NO
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
5000000 Hz
|
3500000 Hz
|
| Max I(ol) |
0.00035999999999999997 A
|
0.00061 A
|
| Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP14,.25
|
SOP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Family |
|
4000/14000/40000
|
| Length |
|
10.3 mm
|
| Number of Bits |
|
7
|
| Propagation Delay (tpd) |
|
1200 ns
|
| Seated Height-Max |
|
1.9 mm
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Trigger Type |
|
NEGATIVE EDGE
|
| Width |
|
5.3 mm
|
| fmax-Min |
|
12 MHz
|
|
|
|
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