HEF4050BT
vs
CD4050BMW
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUFFER
|
BUFFER
|
Max I(ol) |
0.00035999999999999997 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
SOP
|
DFP
|
Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
110 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
DFP
|
Package Description |
|
DFP, DIP16,.3
|
Pin Count |
|
16
|
Additional Feature |
|
IOH = 0.72MA @ VOH = 4.6V; IOL = 3.2MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE
|
Family |
|
4000/14000/40000
|
JESD-609 Code |
|
e0
|
Length |
|
9.6645 mm
|
Number of Functions |
|
6
|
Number of Inputs |
|
1
|
Propagation Delay (tpd) |
|
110 ns
|
Seated Height-Max |
|
2.032 mm
|
Supply Voltage-Max (Vsup) |
|
15 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Terminal Finish |
|
TIN LEAD
|
Width |
|
6.604 mm
|
|
|
|
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