HEF4050BT vs HEF4050BT-Q100 feature comparison

HEF4050BT Philips Semiconductors

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HEF4050BT-Q100 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 110 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Part Package Code SOIC
Package Description SOP,
Pin Count 16
Family 4000/14000/40000
Length 9.9 mm
Number of Functions 6
Number of Inputs 1
Propagation Delay (tpd) 110 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 3.9 mm