HEF4060BD
vs
CD4060BCNX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
ON SEMICONDUCTOR
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
JESD-30 Code
R-XDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Load/Preset Input
NO
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
4000000 Hz
Max I(ol)
0.00035999999999999997 A
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Additional Feature
OUTPUTS FROM 10 STAGES AVAILABLE
Family
4000/14000/40000
Length
19.305 mm
Number of Bits
14
Propagation Delay (tpd)
1300 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Trigger Type
NEGATIVE EDGE
Width
7.62 mm
fmax-Min
4 MHz