HEF4060BD
vs
CD4060BMJ/883B
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Package Description
DIP, DIP16,.3
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
NO
NO
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
4000000 Hz
1000000 Hz
Max I(ol)
0.00035999999999999997 A
0.0088 A
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Family
4000/14000/40000
Length
19.56 mm
Number of Bits
14
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.06 mA
Prop. Delay@Nom-Sup
1300 ns
Propagation Delay (tpd)
1300 ns
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
NEGATIVE EDGE
Width
7.62 mm
fmax-Min
4 MHz
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