HEF4060BD vs HEF4060BDF feature comparison

HEF4060BD NXP Semiconductors

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HEF4060BDF NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature OUTPUTS FROM 10 STAGES AVAILABLE; BUILT-IN OSCILLATOR; OSCILLATOR DISABLED BY CLEAR INPUT OUTPUTS FROM 10 STAGES AVAILABLE; BUILT-IN OSCILLATOR; OSCILLATOR DISABLED BY CLEAR INPUT
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load Capacitance (CL) 50 pF
Load/Preset Input NO YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 4000000 Hz
Max I(ol) 0.00035999999999999997 A
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 14 14
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 420 ns 420 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 30 MHz 30 MHz
Base Number Matches 2 1

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Compare HEF4060BDF with alternatives