Findchips: Compare HEF4069UBT,013 vs CD4069UBCM

HEF4069UBT,013 vs CD4069UBCM feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NATIONAL SEMICONDUCTOR CORP
Part Package Code	SOIC
Package Description	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	PLASTIC, SO-14
Pin Count	14
Manufacturer Package Code	SOT108-1
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01
Factory Lead Time	4 Weeks
Family	4000/14000/40000	4000/14000/40000
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4	e0
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	INVERTER	INVERTER
Moisture Sensitivity Level	1
Number of Functions	6	6
Number of Inputs	1	1
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP14,.25	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	90 ns
Propagation Delay (tpd)	90 ns	90 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	15 V	15 V
Supply Voltage-Min (Vsup)	3 V	3 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	3.9 mm	3.9 mm
Base Number Matches	2	4
	Logic » Gates	Logic » Gates