HEF4076BDF vs CD4076BMN feature comparison

HEF4076BDF NXP Semiconductors

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CD4076BMN Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE; WITH DUAL OUTPUT ENABLE WITH HOLD MODE; WITH DUAL OUTPUT ENABLE; ENABLE TIME @ RL=1K
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 305 ns 400 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 4 MHz 3 MHz
Base Number Matches 1 1
Length 19.34 mm

Compare HEF4076BDF with alternatives

Compare CD4076BMN with alternatives