HEF4086BDB vs CD4086BDMSH feature comparison

HEF4086BDB NXP Semiconductors

Buy Now Datasheet

CD4086BDMSH Harris Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Package Description DIP, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature EXPANDABLE RADIATION HARDENED; 2-2-2-2 INPUT; WITH 2 EXPAND INPUTS
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-CDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 180 ns 608 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2

Compare HEF4086BDB with alternatives

Compare CD4086BDMSH with alternatives