HEF4093BP vs CD4093BDMSH feature comparison

HEF4093BP NXP Semiconductors

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CD4093BDMSH Harris Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code MO-001
Package Description 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-CDIP-T14
JESD-609 Code e4 e0
Length 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method BULK
Prop. Delay@Nom-Sup 185 ns 513 ns
Propagation Delay (tpd) 185 ns 513 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 1
Additional Feature RADIATION HARDENED
Max I(ol) 0.00035999999999999997 A
Screening Level 38535V;38534K;883S
Total Dose 1M Rad(Si) V

Compare HEF4093BP with alternatives

Compare CD4093BDMSH with alternatives