HEF4508BDB vs 5962R9668001VLX feature comparison

HEF4508BDB NXP Semiconductors

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5962R9668001VLX Harris Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH CLEAR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T24 R-CDIP-T24
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 230 ns 260 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.84 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 2
Total Dose 100k Rad(Si) V

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