HEF4539BP
vs
HD14512BRP
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HITACHI LTD
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
DIP, DIP16,.3
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
Length |
21.6 mm
|
9.9 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.00035999999999999997 A
|
|
Number of Functions |
2
|
1
|
Number of Inputs |
4
|
8
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Prop. Delay@Nom-Sup |
245 ns
|
|
Propagation Delay (tpd) |
240 ns
|
750 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.7 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
3.9 mm
|
Base Number Matches |
3
|
1
|
|
|
|
Compare HEF4539BP with alternatives
Compare HD14512BRP with alternatives