HEF4555BP,652 vs CD4555BD3 feature comparison

HEF4555BP,652 NXP Semiconductors

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CD4555BD3 Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code DIP
Package Description PLASTIC, SOT-38-1, DIP-16 ,
Pin Count 16
Manufacturer Package Code SOT38-4
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family 4000/14000/40000 4000/14000/40000
Input Conditioning STANDARD
JESD-30 Code R-PDIP-T16 R-CDIP-T16
JESD-609 Code e4 e0
Length 21.6 mm
Load Capacitance (CL) 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.00035999999999999997 A
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 295 ns
Propagation Delay (tpd) 280 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.7 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 3
Pbfree Code No
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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