HEF4555BPN
vs
5962R9667301VEC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
RENESAS ELECTRONICS CORP
|
| Package Description |
DIP, DIP16,.3
|
DIP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T16
|
R-CDIP-T16
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
2-LINE TO 4-LINE DECODER
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
295 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
3
|
| Family |
|
4000/14000/40000
|
| Input Conditioning |
|
STANDARD
|
| JESD-609 Code |
|
e4
|
| Length |
|
19.05 mm
|
| Output Polarity |
|
TRUE
|
| Propagation Delay (tpd) |
|
594 ns
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Terminal Finish |
|
GOLD
|
| Total Dose |
|
100k Rad(Si) V
|
| Width |
|
7.62 mm
|
|
|
|
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