HEF4555BPN
vs
7704701EA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
HCT
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T16
|
|
| Length |
21.6 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
| Max I(ol) |
0.00035999999999999997 A
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
| Prop. Delay@Nom-Sup |
295 ns
|
|
| Propagation Delay (tpd) |
280 ns
|
660 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.7 mm
|
|
| Supply Voltage-Max (Vsup) |
15 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
4
|
| Additional Feature |
|
2 ENABLE INPUTS
|
|
|
|
Compare HEF4555BPN with alternatives
Compare 7704701EA with alternatives