HEF4555BT,653
vs
MC14555BD
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOP
|
|
| Package Description |
PLASTIC, SOT-108, SO-14
|
SOP, SOP16,.25
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT109-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
OTHER DECODER/DRIVER
|
| Max I(ol) |
0.00035999999999999997 A
|
0.00064 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
295 ns
|
440 ns
|
| Propagation Delay (tpd) |
230 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
15 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
5
|
| Power Supplies |
|
5/15 V
|
|
|
|
Compare HEF4555BT,653 with alternatives