HFA3-0001-5
vs
CLC5801IM
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
TEXAS INSTRUMENTS INC
|
| Package Description |
DIP-8
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
100 µA
|
20 µA
|
| Bias Current-Max (IIB) @25C |
100 µA
|
|
| Common-mode Reject Ratio-Min |
42 dB
|
|
| Common-mode Reject Ratio-Nom |
47 dB
|
95 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
30000 µV
|
800 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Slew Rate-Nom |
875 V/us
|
300 V/us
|
| Supply Current-Max |
75 mA
|
|
| Supply Voltage Limit-Max |
6 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
350000
|
1800000
|
| Voltage Gain-Min |
150
|
|
| Wideband |
YES
|
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Length |
|
4.902 mm
|
| Seated Height-Max |
|
1.753 mm
|
| Width |
|
3.899 mm
|
|
|
|
Compare HFA3-0001-5 with alternatives
Compare CLC5801IM with alternatives