HIP2100EIBZT
vs
HIP2100EIBZ
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
SOICN-EP
|
SOIC
|
| Package Description |
HLSOP,
|
HLSOP,
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
M8.15C
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
26 Weeks, 1 Day
|
|
| Date Of Intro |
2017-10-27
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.89 mm
|
4.89 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLSOP
|
HLSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.68 mm
|
1.68 mm
|
| Supply Voltage-Max |
14 V
|
14 V
|
| Supply Voltage-Min |
9 V
|
9 V
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Turn-off Time |
0.045 µs
|
0.045 µs
|
| Turn-on Time |
0.045 µs
|
0.045 µs
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
Yes
|
| Output Peak Current Limit-Nom |
|
2 A
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|