HIP2100IR4ZT
vs
HIP2100IRZT
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
Package Description |
DFN-12
|
5 X 5 MM, ROHS COMPLIANT, PLASTIC, MO-220VHHB, QFN-16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-10-27
|
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
JESD-30 Code |
S-PDSO-N12
|
S-PQCC-N16
|
Length |
4 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
0.9 mm
|
1 mm
|
Supply Voltage-Max |
14 V
|
14 V
|
Supply Voltage-Min |
9 V
|
9 V
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
QUAD
|
Turn-off Time |
0.045 µs
|
0.045 µs
|
Turn-on Time |
0.045 µs
|
0.045 µs
|
Width |
4 mm
|
5 mm
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFN, SOIC
|
Pin Count |
|
16, 8
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Output Peak Current Limit-Nom |
|
2 A
|
Package Equivalence Code |
|
LCC16,.20SQ,32
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Terminal Finish |
|
Matte Tin (Sn) - annealed
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HIP2100IR4ZT with alternatives
Compare HIP2100IRZT with alternatives