HIP2100IRZT
vs
HIP2100IR4T
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
QFN, SOIC
|
DFN
|
Package Description |
5 X 5 MM, ROHS COMPLIANT, PLASTIC, MO-220VHHB, QFN-16
|
4 X 4 MM, PLASTIC, DFN-12
|
Pin Count |
16, 8
|
12
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
JESD-30 Code |
S-PQCC-N16
|
S-XDSO-N12
|
JESD-609 Code |
e3
|
e0
|
Length |
5 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
12
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Peak Current Limit-Nom |
2 A
|
2 A
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVSON
|
Package Equivalence Code |
LCC16,.20SQ,32
|
SOLCC12,.12,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Voltage-Max |
14 V
|
14 V
|
Supply Voltage-Min |
9 V
|
9 V
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Turn-off Time |
0.045 µs
|
0.045 µs
|
Turn-on Time |
0.045 µs
|
0.045 µs
|
Width |
5 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HIP2100IRZT with alternatives
Compare HIP2100IR4T with alternatives